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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau Livre numérique Kobo
177,99 $ Réduction sur le prix courant 221,59 $ à
2 formats offerts

Solder Joint Reliability: Theory and applications
John H Lau Hardcover
285,95 $
2 formats offerts

Heterogeneous Integrations
John H. Lau Hardcover
248,50 $
2 formats offerts

Fan-out Wafer-level Packaging
John H. Lau Hardcover
233,95 $
3 formats offerts

Assembly And Reliability Of Lead-free Solder Joints
John H. Lau Couverture souple
189,95 $
3 formats offerts

Handbook of Tape Automated Bonding
John H Lau Hardcover
285,95 $

Semiconductor Advanced Packaging
John H. Lau Couverture souple
175,50 $

Chiplet Design and Heterogeneous Integration Packaging
John H. Lau Livre numérique Kobo
177,99 $ Réduction sur le prix courant 221,59 $ à
2 formats offerts

Chiplet Design and Heterogeneous Integration Packaging
John H. Lau Couverture souple
189,95 $

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau Couverture souple
72,95 $