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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Gerard Kelly

8 octobre 2012

160,95 $

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Description

Langue

anglais

Pages

134

Publié par: Springer/Sci-Tech/Trade

Dimensions à l’expédition: 9" H x 6" W x 1" L

ISBN: 9781461372769

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