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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

G.Q. Zhang Édition : L.J. Ernst , O. de Saint Leger

3 décembre 2010

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Description

Langue

anglais

Pages

192

Publié par: Springer/Sci-Tech/Trade

Dimensions à l’expédition: 10" H x 7" W x 1" L

ISBN: 9781441948731

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