3d Microelectronic Packaging: From Fundamentals To Applications

Name: 3d Microelectronic Packaging: From Fundamentals To Applications
Price: 291.95 CAD
Availability: InStock
Author: Deepak Goyal
ISBN: 9783319830865

Yan Li Édition : Deepak Goyal

13 juillet 2018

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Description

Langue

anglais

Pages

463

Springer Series In Advanced Microelectronics

Publié par: Springer Nature

Dimensions à l’expédition: 9" H x 6" W x 1" L

ISBN: 9783319830865

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Évaluation éditoriale

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3d Microelectronic Packaging: From Architectures To Applications /fr-ca/3d-microelectronic-packaging-from-architectures-to-applications/95E7449F-23C6-4A0B-A3C0-BC56187AA31E.html 95E7449F-23C6-4A0B-A3C0-BC56187AA31E

3d Microelectronic Packaging: From Architectures To Applications

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3d Microelectronic Packaging: From Fundamentals To Applications

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3d Microelectronic Packaging: From Fundamentals To Applications

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3d Microelectronic Packaging: From Fundamentals To Applications

Description

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