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Wafer Bonding: Applications and Technology

Marin Alexe Edited by Ulrich Gösele
Sep 30, 2011
$554.95
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Overview

Appropriate for
Language
English
No. of Pages
504
Springer Series in Materials Science
Publisher: Springer/Sci-Tech/Trade
Shipping dimensions: 9" H x 6" W x 1" L
ISBN: 9783642059155
Life stage: null

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Editorial reviews

ulrich gosele

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