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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Gerard Kelly
Apr 30, 1999
$142.95
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Overview

Appropriate for
Language
English
No. of Pages
134
Publisher: Springer US
Shipping dimensions: 9" H x 6" W x 1" L
ISBN: 9780792384854
Life stage: null

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