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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Sep 30, 2015
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Overview

Publisher: Springer US
Shipping dimensions: null
ISBN: 9781461550112
Life stage: null

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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages 22B32609-6F26-42E4-9D16-6657356C1FEC
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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160.95
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
https://dynamic.indigoimages.ca/v1/https://cdn.kobo.com/book-images/4a444a32-1bcf-41d4-8cc7-a5203a526aea/300/300/False/image.jpg
135.87
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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142.95