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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

Shen Liu , Yong Liu
May 17, 2011
$218.95
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Overview

Appropriate for
Language
English
No. of Pages
576
Publisher: Wiley
Shipping dimensions: 10" H x 7" W x 1" L
ISBN: 9780470827802
Life stage: null

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