Free Preview of Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
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Overview
Publisher: Wiley
Shipping dimensions: 10" H x 7" W x 1" L
ISBN: 9780470827802
Life stage: null
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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
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65CDB364-033D-4000-BD5E-A1266B00890D
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
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218.95
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
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175.99