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  • Front cover_Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990
Free Preview of Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A.

Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A.

Edited by Qinghuang Lin , E. Todd Ryan , Wen-li Wu
Jun 05, 2014
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Overview

Appropriate for
Language
English
No. of Pages
358
MRS Proceedings
Publisher: Cambridge University Press
Shipping dimensions: 1" H x 1" W x 1" L
ISBN: 9781107408715
Life stage: null

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