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Free Preview of Interconnect Reliability in Advanced Memory Device Packaging

Interconnect Reliability in Advanced Memory Device Packaging

Chong Leong, Gan , Chen-Yu, Huang
Apr 29, 2023
$321.50
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Overview

Appropriate for
Language
English
No. of Pages
210
Springer Series in Reliability Engineering
Publisher: Springer Nature
Shipping dimensions: 9" H x 6" W x 1" L
ISBN: 9783031267079
Life stage: null

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