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  • Front cover_Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

John Lau , Xuejun Fan
Apr 18, 2025
$290.95
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Overview

Appropriate for
Language
English
No. of Pages
326
Publisher: Springer Nature
Shipping dimensions: 9" H x 6" W x 1" L
ISBN: 9789819641659
Life stage: null

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