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Free Preview of Embedded And Fan-out Wafer And Panel Level Packaging Technologies For Advanced Application Spaces: High Performance Compute And System-in-package

Embedded And Fan-out Wafer And Panel Level Packaging Technologies For Advanced Application Spaces: High Performance Compute And System-in-package

Edited by Steffen Kröhnert , Beth Keser
Dec 29, 2021
$184.95
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Overview

Appropriate for
Language
English
No. of Pages
320
Ieee Press
Publisher: Wiley
Shipping dimensions: 0" H x 0" W x 0" L
ISBN: 9781119793779
Life stage: null

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steffen krohnert

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