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Foldable Flex and Thinned Silicon Multichip Packaging Technology

Edited by John W Balde
Feb 23, 2014
$220.95
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Overview

Appropriate for
Language
No. of Pages
347
Emerging Technology In Advanced Packaging
Publisher: Springer US
Shipping dimensions: 9" H x 6" W x 1" L
ISBN: 9781461349778
Life stage: null

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john w balde

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