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Semiconductor Advanced Packaging
John H. Lau Hardcover
$262.95
2 formats available

Solder Joint Reliability: Theory and applications
John H Lau Hardcover
$285.95
2 formats available

Heterogeneous Integrations
John H. Lau Hardcover
$248.50
2 formats available

Fan-out Wafer-level Packaging
John H. Lau Hardcover
$233.95
3 formats available

Assembly And Reliability Of Lead-free Solder Joints
John H. Lau Paperback
$189.95
3 formats available

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau Kobo eBook
$177.99 Price reduced from $221.59 to
2 formats available

Chiplet Design and Heterogeneous Integration Packaging
John H. Lau Kobo eBook
$177.99 Price reduced from $221.59 to
2 formats available

Handbook of Tape Automated Bonding
John H Lau Hardcover
$285.95

Semiconductor Advanced Packaging
John H. Lau Paperback
$175.50

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau Paperback
$72.95

Chiplet Design and Heterogeneous Integration Packaging
John H. Lau Paperback
$189.95