Buy Now, In-Store Pick Up Only

  • Front cover_Materials for Information Technology
Free Preview of Materials for Information Technology: Devices, Interconnects and Packaging

Materials for Information Technology: Devices, Interconnects and Packaging

Ehrenfried Zschech Edited by Caroline Whelan , Thomas Mikolajick
Oct 22, 2010
$319.95
Online pricing. Prices and offers may vary in store.
.
This product requires a minimum order of  1
Final Sale. No returns or exchanges.
This item will be shipped by appointment through our delivery partner.

Ship to me

Checking availability…

Buy now & pick up in store

Checking availability…

Find it in store

Checking availability…

Earn 1,600 points and enjoy extra savings with plum+. 

Overview

Appropriate for
Language
English
No. of Pages
508
Engineering Materials and Processes
Publisher: Springer/Sci-Tech/Trade
Shipping dimensions: 9" H x 6" W x 1" L
ISBN: 9781849969673
Life stage: null

You May Also Like

Ratings & Reviews

  • bvseo_sdk, dw_cartridge, 18.2.0, p_sdk_3.2.0
  • CLOUD, getReviews, 17ms
  • reviews, product
  • bvseo-msg: Unsuccessful GET. status = 'ERROR', msg = 'Not Found.'; Unsuccessful GET. status = 'ERROR', msg = 'Not Found.';

Editorial reviews

caroline whelan

Author

Others Also Bought

Materials for Information Technology: Devices, Interconnects and Packaging C4C11D07-7EB7-4B76-B143-F572C7485836
Materials For Information Technology: Devices, Interconnects and Packaging
https://dynamic.indigoimages.ca/v1/books/books/1852339411/1.jpg
321.5
Materials for Information Technology: Devices, Interconnects and Packaging
https://dynamic.indigoimages.ca/v1/books/books/1849969671/1.jpg
319.95